Customization: | Available |
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Certification: | ISO |
Application: | Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass |
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Core Selling Points
Key foundational material for 5G industry chain
Purity ≥ 99%, ultra-low impurity content
Precisely controlled particle size (D50 0.5-50μm)
Low dielectric constant/loss, compatible with high-frequency signal transmission
Thermal expansion coefficient matches semiconductor materials
Product Parameters
Indicator | Parameter Value |
---|---|
SiO2 Content | ≥ 99% |
Particle Size (D50) | 0.5μm-50μm (customizable) |
Whiteness | ≥ 92% |
Moisture Content | ≤ 0.1% |
Dielectric Constant | 3.8-4.2 (1MHz) |
Dielectric Loss | ≤ 0.001 |
Morphology | Spherical/Near-spherical (electronic grade) |
5G Industry Applications
▸ High-frequency PCB board filler ▸ Ceramic filter dielectric ▸ Chip packaging material
▸ Antenna cover composite material ▸ Thermal interface material ▸ Electronic ink additive
Product Advantages
High-Frequency Compatibility - Optimized dielectric properties, significantly reducing 5G millimeter-wave signal attenuation
Precision Processing - Laser particle size control technology, batch deviation < ±3%
Strong Stability - Certified with ISO 9001/14001 dual systems
Customization Service - Supports surface modification (e.g., silane coupling agent treatment)
Packaging & Shipping
25kg/cardboard drum (PE-lined)
Custom packaging available upon request
Technical Q&A
Q: How to select the right particle size for 5G substrate materials?
A: Recommended based on dielectric layer thickness:
• 10-20μm for thick-film circuits
• 1-5μm for high-frequency thin-layer materials
Q: Does the product comply with RoHS standards?
A: All products pass RoHS 2.0 and REACH testing, with third-party test reports provided
Corporate Strength
▪ National High-Tech Enterprise ▪ Annual production capacity of 5,000 tons of silica powder
▪ Strategic partnership with Chinese Academy of Sciences' Silicon Materials Research Institute
▪ Serves leading clients like Huawei/ZTE