Ultrafine Flexible Composite Silica Powder for IC Packaging

Product Details
Customization: Available
Certification: ISO
Application: Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass
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  • Ultrafine Flexible Composite Silica Powder for IC Packaging
  • Ultrafine Flexible Composite Silica Powder for IC Packaging
  • Ultrafine Flexible Composite Silica Powder for IC Packaging
  • Ultrafine Flexible Composite Silica Powder for IC Packaging
  • Ultrafine Flexible Composite Silica Powder for IC Packaging
  • Ultrafine Flexible Composite Silica Powder for IC Packaging
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Basic Info.

Model NO.
SR/SK
Mohs Hardness
5
Exterior
White Powder
D50
0.5μm-10μm
Pyroconductivity
0.8W/K.M
Transport Package
Paper Bag, Big Bag, Pallet
Specification
SiO2 60%± 3
Trademark
ST
Origin
Lianyungang, China
HS Code
2811229000
Production Capacity
50000pieces/Year

Product Description

product information:
Ultrafine Flexible Composite Silica Powder for IC Packaging
Ultrafine Flexible Composite Silica Powder for IC Packaging
Ultrafine Flexible Composite Silica Powder for IC Packaging


Product Description

 

This product is a high-performance ultrafine flexible composite silica powder specially designed for integrated circuit (IC) packaging. It features excellent flowability, low stress, high filling rate, and low coefficient of thermal expansion (CTE), significantly enhancing the reliability and thermal performance of packaging materials. With special surface treatment technology, it ensures high compatibility with epoxy resins and other packaging materials, making it suitable for advanced packaging technologies (e.g., FC-BGA, CSP, SiP).

 

Product Specifications

 
Parameter Value
Particle Size (D50) 0.5-10μm (customizable)
Purity (SiO2) ≥60%
Surface Treatment Silane coupling agent (optional)
Moisture Content ≤0.2%
Item Unit Typical Values
Exterior / white powder
Density kg/m³ 2.58 ×103
Moh's hardness / 5
Coefficient of linear expansion 1/k 0.8×10-6
Pyroconductivity w/k.m 0.8
Refraction coefficient / /


Applications

 

 Advanced IC Packaging: FC-BGA, CSP, SiP, Fan-Out, etc.
 Electronic Adhesives: High thermal conductivity, low-stress encapsulants
 PCB Substrate Materials: Filler for high-frequency/high-speed substrates
 LED Packaging: Improves heat dissipation and reduces thermal resistance
 Power Device Packaging: IGBT, MOSFET, and other high-power devices

 

Key Advantages

 

 Ultrafine Particle Size: 0.5-10μm ensures high filling rate and reduces void formation
 Low Thermal Expansion: Matches silicon chips, minimizing packaging stress and improving reliability
 Low Dielectric Loss: Ideal for high-frequency/high-speed applications
 Customizable: Tailored particle size and surface treatment available

 

Packaging & Storage

 
  • Packaging: 25kg/bag (customizable)

  • Storage: Store in a cool, dry place; avoid moisture. Shelf life: 12 months

 

Compliance Standards

 

 RoHS/REACH compliant
 

 

Why Choose Our Product?

 
  1. Professional Electronic-Grade Material: Optimized for IC packaging, ensuring high reliability and stability

  2. Advanced Manufacturing Process: Ultrafine particle size improves packaging yield

  3. Technical Support: Customized solutions for diverse packaging requirements

 Contact Us: Request samples or technical consultation!

 

 

 

Company Information:
Jiangsu Shengtian New Materials Co., Ltd. has a technical research and development team focusing on ultra-fine powder materials, and has strong strength in the research and development and production of ultra-fine functional materials, composite materials and related applications, and has become a more influential high-tech enterprise in the ultra-fine functional powder industry.
The company's products include crystalline silicon powder, molten silicon powder, soft composite silicon powder, spherical silicon powder, aluminum oxide powder, ceramic powder, glass powder and other ten categories, nearly 100 kinds of different specifications of products, and has a strong modification, compounding and other follow-up deep processing technology and capabilities. The products are processed by special technology, the production technology is leading and innovative, and the introduction of international technical standards for similar products, widely used in electronic packaging, copper clad plate, ink coating, adhesive, ceramics, precision casting, glass fiber, plastic rubber and other industries, giving its functionality while helping customers reduce costs. And provide the overall application of technology solutions.
The company has more than 20 different types of production lines, more than 100 sets of domestic advanced equipment, with an annual output of 50,000 tons. The company adopts professional production and testing equipment and formulates strict production quality control system to conduct all-round control of product quality. All products of the company have passed SGS environmental protection testing, in line with the EU ROHS green environmental protection standards. The company took the lead in the silicon powder industry through the ISO9001 quality management system certification and ISO14001 environmental management system certification, has passed the high-tech product identification. The company's products and solutions have been applied to more than 160 enterprises around the world, including more than 80 customers with stable cooperation for more than 10 years.
Ultrafine Flexible Composite Silica Powder for IC Packaging

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Ultrafine Flexible Composite Silica Powder for IC Packaging
Ultrafine Flexible Composite Silica Powder for IC Packaging
Ultrafine Flexible Composite Silica Powder for IC Packaging


An excellent manufacturing enterprise

The company has 20 patents, the company has passed ISO9001 and ISO14001 certification, and has been recognized as a national high-tech enterprise

Ultrafine Flexible Composite Silica Powder for IC Packaging

 




 

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