Customization: | Available |
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Certification: | ISO |
Application: | Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass |
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This product is a high-performance ultrafine flexible composite silica powder specially designed for integrated circuit (IC) packaging. It features excellent flowability, low stress, high filling rate, and low coefficient of thermal expansion (CTE), significantly enhancing the reliability and thermal performance of packaging materials. With special surface treatment technology, it ensures high compatibility with epoxy resins and other packaging materials, making it suitable for advanced packaging technologies (e.g., FC-BGA, CSP, SiP).
Parameter | Value |
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Particle Size (D50) | 0.5-10μm (customizable) |
Purity (SiO2) | ≥60% |
Surface Treatment | Silane coupling agent (optional) |
Moisture Content | ≤0.2% |
Item | Unit | Typical Values |
Exterior | / | white powder |
Density | kg/m³ | 2.58 ×103 |
Moh's hardness | / | 5 |
Coefficient of linear expansion | 1/k | 0.8×10-6 |
Pyroconductivity | w/k.m | 0.8 |
Refraction coefficient | / | / |
Advanced IC Packaging: FC-BGA, CSP, SiP, Fan-Out, etc.
Electronic Adhesives: High thermal conductivity, low-stress encapsulants
PCB Substrate Materials: Filler for high-frequency/high-speed substrates
LED Packaging: Improves heat dissipation and reduces thermal resistance
Power Device Packaging: IGBT, MOSFET, and other high-power devices
Ultrafine Particle Size: 0.5-10μm ensures high filling rate and reduces void formation
Low Thermal Expansion: Matches silicon chips, minimizing packaging stress and improving reliability
Low Dielectric Loss: Ideal for high-frequency/high-speed applications
Customizable: Tailored particle size and surface treatment available
Packaging: 25kg/bag (customizable)
Storage: Store in a cool, dry place; avoid moisture. Shelf life: 12 months
RoHS/REACH compliant
Professional Electronic-Grade Material: Optimized for IC packaging, ensuring high reliability and stability
Advanced Manufacturing Process: Ultrafine particle size improves packaging yield
Technical Support: Customized solutions for diverse packaging requirements
Contact Us: Request samples or technical consultation!