Customization: | Available |
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Certification: | ISO |
Application: | Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass |
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Electronic Packaging: Chip packaging adhesives, epoxy molding compounds, improving thermal conductivity and reducing the coefficient of thermal expansion.
Composite Materials: Enhances the mechanical properties and wear resistance of engineering plastics and rubbers.
Coatings/Inks: Improves the hardness, scratch resistance, and leveling property of the coating.
Adhesives: Optimizes the bonding strength and reduces the curing shrinkage rate.
Ceramic Materials: Promotes sintering densification and improves the mechanical strength of ceramic products.
Thermal Conductive Interface Materials: Applied in high-efficiency thermal conductive scenarios such as 5G heat sinks and LED heat dissipation substrates.
Item | Unit | Typical Values |
Exterior | / | white powder |
Density | kg/m³ | 2.2 ×103 |
Moh's hardness | / | 6 |
Coefficient of linear expansion | 1/k | 0.5×10-6 |
Pyroconductivity | w/k.m | 1.45 |
Refraction coefficient | / | / |