Customization: | Available |
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Certification: | ISO |
Application: | Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass |
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Product Overview
Specially developed for high-end material applications, this large-particle spherical silicon powder is produced via plasma atomization, offering ultra-high purity (≥99.6%) and near-perfect sphericity (≥97%). The unique 10-20μm particle size design significantly enhances flowability, making it an ideal choice for thermal conductive materials, electronic packaging, 3D printing, and other advanced applications.
Core Advantages
Exceptional Purity Standards: Metallic impurity content <400ppm, certified by ICP-MS testing
Industry-Leading Sphericity: Sphericity rate ≥97%, smooth surface without burrs
Tailored Particle Size Distribution: D50 controlled at 15±2μm, optimized for high-precision coating and filling processes
Technical Parameters
Parameter | Value |
---|---|
Purity | ≥99.6% |
Sphericity | ≥97% |
Particle Size Range | 10-20μm (D90 controlled) |
Oxygen Content | ≤800ppm |
Tap Density | ≥1.6g/cm³ |
Specific Surface Area | 0.5-1.2m²/g |
Typical Applications
High-end electronic packaging materials (EMC, Underfill)
Thermal grease/thermal pad filler reinforcement
Ceramic substrate (LTCC/HTCC) sintering aid
Additive manufacturing (3D printing) powder material
Anti-settling agent for specialty coatings
Packaging & Shipping
25kg/bag (customizable)
Quality Certifications
▫ ISO 9001:2015 Quality Management System
▫ SGS COA Test Report
▫ Particle size analysis report provided
Service Commitment
♦ Free samples available (500g trial sample)
♦ Professional technical team for application support
♦ Strict confidentiality of customer project information
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