Spherical Alumina Filler for Advanced Packaging

Product Details
Customization: Available
Certification: ISO
Application: Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass
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  • Spherical Alumina Filler for Advanced Packaging
  • Spherical Alumina Filler for Advanced Packaging
  • Spherical Alumina Filler for Advanced Packaging
  • Spherical Alumina Filler for Advanced Packaging
  • Spherical Alumina Filler for Advanced Packaging
  • Spherical Alumina Filler for Advanced Packaging
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Basic Info.

Model NO.
SA
Transport Package
Paper Bag, Big Bag, Pallet
Specification
Al2O3>99.5%
Trademark
ST
Origin
Lianyungang, China
HS Code
2811229000
Production Capacity
50000pieces/Year

Product Description

product information:
Spherical Alumina Filler for Advanced Packaging
Spherical Alumina Filler for Advanced Packaging
Spherical Alumina Filler for Advanced Packaging
Product Description:
 

This high-purity electronic-grade spherical alumina filler is specifically designed for advanced semiconductor packaging applications (e.g., FC-BGA, Chiplet, 3D IC). Manufactured using precision spheroidization technology, it features:

  • High purity (≥99.5%)

  • Low alpha-ray emission

  • Excellent thermal conductivity (≥30 W/m·K)

It significantly enhances the thermal management performance and mechanical strength of packaging materials, making it ideal for high-density, high-reliability electronic packaging.

 
Product Parameters
 
Item Technical Indicators
Chemical Formula α-Al2O3 (≥99.5%)
Particle Size Range D50 2-50μm (customizable)
Sphericity ≥95%
Thermal Conductivity 30-35 W/(m·K)
Dielectric Constant 9-10 (1MHz)
Purity ≥99.5%
Moisture Content ≤0.5%

 

Applications

 

 Advanced Semiconductor Packaging:

  • FC-BGA (Flip-Chip Ball Grid Array)

  • 2.5D/3D IC (Silicon Interposer, TSV Filling)

  • Chiplet Integration

 High-Thermal-Conductivity Packaging Materials:

  • Epoxy Molding Compound (EMC) Filler

  • Thermal Gel/Adhesive Reinforcement

 5G/High-Frequency Electronics:

  • Millimeter-Wave RF Device Packaging

  • Power Module (IGBT/SiC) Heat Dissipation

 

Key Advantages

 

 High Purity: 99.5% purity minimizes ionic contamination, ensuring chip reliability
 Low Alpha-Ray: Meets low-radiation requirements for advanced memory chips (DRAM/NAND)
 Optimized Thermal Management: High thermal conductivity (≥30 W/m·K) reduces thermal resistance
 Precise Particle Size Control: Adjustable 0.5-20μm for diverse packaging processes
 High Sphericity: Reduces stress concentration and improves flowability/filling rate

 

Why Choose Us?

 

 Specialization in Electronic-Grade Materials: Complies with international standards
 Customization Services: Tailored particle size and surface modification (e.g., silane coupling)
 Stable Supply: 200-ton monthly capacity with high batch consistency
 Technical Support: Thermal simulation and formulation optimization available

 

Packaging & Shipping

 
  • Packaging: 25kg/bag (customizable)

  • Shipping: Moisture-proof and shock-resistant, global logistics supported

 

Ideal for: Semiconductor packaging material manufacturers, EMC suppliers, 5G device makers
RFQ Note: Please specify required particle size, purity, and surface treatment

 

Company Information:
Jiangsu Shengtian New Materials Co., Ltd. has a technical research and development team focusing on ultra-fine powder materials, and has strong strength in the research and development and production of ultra-fine functional materials, composite materials and related applications, and has become a more influential high-tech enterprise in the ultra-fine functional powder industry.
The company's products include crystalline silicon powder, molten silicon powder, soft composite silicon powder, spherical silicon powder, aluminum oxide powder, ceramic powder, glass powder and other ten categories, nearly 100 kinds of different specifications of products, and has a strong modification, compounding and other follow-up deep processing technology and capabilities. The products are processed by special technology, the production technology is leading and innovative, and the introduction of international technical standards for similar products, widely used in electronic packaging, copper clad plate, ink coating, adhesive, ceramics, precision casting, glass fiber, plastic rubber and other industries, giving its functionality while helping customers reduce costs. And provide the overall application of technology solutions.
The company has more than 20 different types of production lines, more than 100 sets of domestic advanced equipment, with an annual output of 50,000 tons. The company adopts professional production and testing equipment and formulates strict production quality control system to conduct all-round control of product quality. All products of the company have passed SGS environmental protection testing, in line with the EU ROHS green environmental protection standards. The company took the lead in the silicon powder industry through the ISO9001 quality management system certification and ISO14001 environmental management system certification, has passed the high-tech product identification. The company's products and solutions have been applied to more than 160 enterprises around the world, including more than 80 customers with stable cooperation for more than 10 years.
Spherical Alumina Filler for Advanced Packaging

Workshop:
 
Spherical Alumina Filler for Advanced Packaging
Spherical Alumina Filler for Advanced Packaging
Spherical Alumina Filler for Advanced Packaging


An excellent manufacturing enterprise

The company has 20 patents, the company has passed ISO9001 and ISO14001 certification, and has been recognized as a national high-tech enterprise

Spherical Alumina Filler for Advanced Packaging

 




 

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