Microelectronic Packaging Spherical Alumina Powder

Product Details
Customization: Available
Certification: ISO
Application: Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass
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  • Microelectronic Packaging Spherical Alumina Powder
  • Microelectronic Packaging Spherical Alumina Powder
  • Microelectronic Packaging Spherical Alumina Powder
  • Microelectronic Packaging Spherical Alumina Powder
  • Microelectronic Packaging Spherical Alumina Powder
  • Microelectronic Packaging Spherical Alumina Powder
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Basic Info.

Model NO.
SA
Transport Package
Paper Bag, Big Bag, Pallet
Specification
Al2O3>99.5%
Trademark
ST
Origin
Lianyungang, China
HS Code
2811229000
Production Capacity
50000pieces/Year

Product Description

product information:
Microelectronic Packaging Spherical Alumina Powder
Microelectronic Packaging Spherical Alumina Powder
Microelectronic Packaging Spherical Alumina Powder
Product Description:

This high-purity electronic-grade spherical alumina powder is specifically designed for microelectronic packaging and advanced semiconductor applications. Featuring excellent sphericity (≥95%), high thermal conductivity (≥30 W/m·K), and low alpha radiation (≤0.01 cph/cm²), it significantly enhances the thermal performance and reliability of packaging materials. Ideal for high-density integrated circuits (ICs), power modules, LED devices, and 5G component packaging.
 
Product Parameters
 
Item Technical Indicators
Chemical Formula α-Al2O3 (≥99.5%)
Particle Size Range D50 2-50μm (customizable)
Sphericity ≥95%
Thermal Conductivity 30-35 W/(m·K)
Dielectric Constant 9-10 (1MHz)
Purity ≥99.5%
Moisture Content ≤0.5%

 

Applications

 

 Semiconductor Packaging: Advanced packaging processes including BGA, CSP, and Flip-Chip
 Power Electronics: Thermal filler for IGBT and MOSFET modules
 LED Packaging: Improves heat dissipation and light efficiency of LED devices
 5G Communications: High-frequency substrates and high-power RF component packaging
 Electronic Ceramics: HTCC/LTCC substrates and insulation layers

 

Key Advantages

 

 High Purity: 99.5% purity with ultra-low metal impurities, meeting semiconductor-grade requirements
 Perfect Sphericity: ≥95% sphericity for improved packing density and flowability
 Superior Thermal Conductivity: ≥30 W/m·K thermal conductivity for effective chip junction temperature reduction
 Low Alpha Radiation: ≤0.01 cph/cm² to prevent soft errors and enhance device reliability
 Adjustable Particle Size: 2-50μm options available to suit various packaging processes

 

Packaging & Storage

 
  • Packaging: 25kg/bag (customizable)

  • Storage: Store in cool, dry conditions away from moisture and contaminants

 

Why Choose Us?

 

 Electronic-Grade Specialization: 15 years of expertise in high-purity electronic materials
 Strict Quality Control: ISO 9001/IATF 16949 certified
 Customization Service: Tailored particle size and surface modification options
 Global Supply: Serving 100+ semiconductor industry clients

 

Company Information:
Jiangsu Shengtian New Materials Co., Ltd. has a technical research and development team focusing on ultra-fine powder materials, and has strong strength in the research and development and production of ultra-fine functional materials, composite materials and related applications, and has become a more influential high-tech enterprise in the ultra-fine functional powder industry.
The company's products include crystalline silicon powder, molten silicon powder, soft composite silicon powder, spherical silicon powder, aluminum oxide powder, ceramic powder, glass powder and other ten categories, nearly 100 kinds of different specifications of products, and has a strong modification, compounding and other follow-up deep processing technology and capabilities. The products are processed by special technology, the production technology is leading and innovative, and the introduction of international technical standards for similar products, widely used in electronic packaging, copper clad plate, ink coating, adhesive, ceramics, precision casting, glass fiber, plastic rubber and other industries, giving its functionality while helping customers reduce costs. And provide the overall application of technology solutions.
The company has more than 20 different types of production lines, more than 100 sets of domestic advanced equipment, with an annual output of 50,000 tons. The company adopts professional production and testing equipment and formulates strict production quality control system to conduct all-round control of product quality. All products of the company have passed SGS environmental protection testing, in line with the EU ROHS green environmental protection standards. The company took the lead in the silicon powder industry through the ISO9001 quality management system certification and ISO14001 environmental management system certification, has passed the high-tech product identification. The company's products and solutions have been applied to more than 160 enterprises around the world, including more than 80 customers with stable cooperation for more than 10 years.
Microelectronic Packaging Spherical Alumina Powder

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Microelectronic Packaging Spherical Alumina Powder
Microelectronic Packaging Spherical Alumina Powder
Microelectronic Packaging Spherical Alumina Powder


An excellent manufacturing enterprise

The company has 20 patents, the company has passed ISO9001 and ISO14001 certification, and has been recognized as a national high-tech enterprise

Microelectronic Packaging Spherical Alumina Powder

 




 

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