Product Description
This product is high-purity spherical aluminum oxide powder (Al2O3), designed for high-end applications such as electronic packaging, thermal interface materials (TIM), and LED heat dissipation. It features ultra-high thermal conductivity, excellent insulation, and a high filling rate. Using an advanced plasma melting spheroidization process, it ensures high particle sphericity and uniform particle size distribution, significantly enhancing the thermal conductivity of composite materials while maintaining good fluidity and processability.
Product Parameters
Item |
Parameters |
Chemical Formula |
Al2O3 (α-alumina) |
Purity |
≥99.5% |
Thermal Conductivity |
30-40 W/(m·K) |
Particle Size (D50) |
1μm-50μm (customizable) |
Sphericity |
≥95% |
Density |
3.7 g/cm³ |
Insulation Resistance |
≥1014 Ω·cm |
Moisture Content |
≤0.5% |
Application Fields |
Thermal adhesives, thermal pads, 5G materials, semiconductor packaging |
Core Advantages
Ultra-High Thermal Conductivity - Thermal conductivity reaches 30-40 W/(m·K), significantly improving heat dissipation efficiency.
High Purity (≥99.5%) - Low sodium and chlorine content, suitable for precision electronic packaging.
Perfect Sphericity (≥95%) - Increases filling rate and reduces viscosity of composite materials.
Customizable Particle Size (1-50μm) - Meets the needs of different thermal conductive materials.
Excellent Insulation - Insulation resistance ≥1014 Ω·cm, ensuring the safety of electronic devices.
Low Oil Absorption Value - Optimizes the processing performance of resin systems.
Typical Applications
Thermal Interface Materials (TIM): Thermal grease, thermal gel, thermal pads
LED Packaging: Improves heat dissipation performance of LED chips and extends service life
5G Communication Materials: Heat dissipation fillers for high-frequency substrates and RF devices
Semiconductor Packaging: Chip bonding materials, EMC (epoxy molding compounds)
New Energy Batteries: Thermal and insulating coatings for power batteries
Why Choose Us?
Advanced Spheroidization Process - Prepared by plasma melting method, particles are non-angular with excellent fluidity.
Strict Quality Control - Compliant with RoHS and REACH standards, suitable for high-end electronics industry.
Technical Support - Provides surface modification (silane coupling agent treatment) to optimize dispersibility.
Stable Supply - Supports customized particle size distribution.
Packaging and Transportation
Standard Packaging: 25kg/bag, customizable options available.
Transportation: Sea/air freight, global logistics support.
Inquiry Tips
For sample testing or technical data sheets (TDS/MSDS), please contact us!
Supports OEM/ODM, product specifications can be adjusted according to customer requirements.