Spherical Alumina Powder for Electronic Packaging

Product Details
Customization: Available
Certification: ISO
Application: Rubber, Plastic, Chemical, Construction, Metallurgy, Ceramic, Casting, Glass
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  • Spherical Alumina Powder for Electronic Packaging
  • Spherical Alumina Powder for Electronic Packaging
  • Spherical Alumina Powder for Electronic Packaging
  • Spherical Alumina Powder for Electronic Packaging
  • Spherical Alumina Powder for Electronic Packaging
  • Spherical Alumina Powder for Electronic Packaging
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Basic Info.

Model NO.
SA
Transport Package
Paper Bag, Big Bag, Pallet
Specification
Al2O3>99.5%
Trademark
ST
Origin
Lianyungang, China
HS Code
2811229000
Production Capacity
50000pieces/Year

Product Description

product information:
Spherical Alumina Powder for Electronic Packaging
Spherical Alumina Powder for Electronic Packaging
Spherical Alumina Powder for Electronic Packaging
Product Description
This product is high-purity and high-sphericity electronic-grade spherical aluminum oxide powder (α-Al2O3), specifically designed for high-end electronic packaging applications. It offers excellent thermal conductivity, insulation, and filling performance, significantly enhancing the heat dissipation efficiency and reliability of electronic components such as semiconductor packages, LEDs, and power modules.
 
Product Parameters
 
Item Technical Indicators
Chemical Formula α-Al2O3 (≥99.5%)
Particle Size Range D50 0.5-50μm (customizable)
Sphericity ≥95%
Thermal Conductivity 30-35 W/(m·K)
Dielectric Constant 9-10 @1MHz
Purity ≥99.5%
Moisture Content ≤0.5%
 
Application Fields
Semiconductor Packaging: Used as packaging materials for chips such as CPU, GPU, and IGBT to improve heat dissipation performance.
LED Packaging: Serves as a phosphor carrier or thermal conductive filler to extend LED lifespan.
5G Communication Modules: Enhances thermal management capabilities of high-frequency substrates.
Power Electronics: Suitable for high-temperature applications in new energy vehicles, photovoltaic inverters, etc.
High Thermal Conductivity Adhesives/Pastes: Optimizes thermal conductivity efficiency of thermal interface materials (TIM).
 
Product Advantages
Ultra-high Purity: Low metal impurity content meets semiconductor-grade requirements.
High Sphericity (≥95%): Excellent fluidity and high filling rate reduce resin usage.
Superior Thermal Conductivity: Thermal conductivity reaches 30-35 W/(m·K), significantly lowering device operating temperatures.
Reliable Insulation: Stable dielectric constant suitable for high-frequency circuit environments.
Customizable Particle Size: Supports particle size adjustment from 0.5-50μm to adapt to different packaging processes.
 
Packaging and Storage
 
  • Packaging: Customizable according to customer requirements.
  • Storage: Store in a sealed container in a dry environment to avoid moisture absorption.
 
Why Choose Us?
Electronic-grade Dedicated Production: Production lines comply with ISO 9001/14001 standards, ensuring stable and controllable purity.
Technical Support: Provides customized services for particle size distribution, surface modification, etc.
Global Supply: Long-term cooperative clients include renowned packaging material manufacturers.


Company Information:
Jiangsu Shengtian New Materials Co., Ltd. has a technical research and development team focusing on ultra-fine powder materials, and has strong strength in the research and development and production of ultra-fine functional materials, composite materials and related applications, and has become a more influential high-tech enterprise in the ultra-fine functional powder industry.
The company's products include crystalline silicon powder, molten silicon powder, soft composite silicon powder, spherical silicon powder, aluminum oxide powder, ceramic powder, glass powder and other ten categories, nearly 100 kinds of different specifications of products, and has a strong modification, compounding and other follow-up deep processing technology and capabilities. The products are processed by special technology, the production technology is leading and innovative, and the introduction of international technical standards for similar products, widely used in electronic packaging, copper clad plate, ink coating, adhesive, ceramics, precision casting, glass fiber, plastic rubber and other industries, giving its functionality while helping customers reduce costs. And provide the overall application of technology solutions.
The company has more than 20 different types of production lines, more than 100 sets of domestic advanced equipment, with an annual output of 50,000 tons. The company adopts professional production and testing equipment and formulates strict production quality control system to conduct all-round control of product quality. All products of the company have passed SGS environmental protection testing, in line with the EU ROHS green environmental protection standards. The company took the lead in the silicon powder industry through the ISO9001 quality management system certification and ISO14001 environmental management system certification, has passed the high-tech product identification. The company's products and solutions have been applied to more than 160 enterprises around the world, including more than 80 customers with stable cooperation for more than 10 years.
Spherical Alumina Powder for Electronic Packaging

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Spherical Alumina Powder for Electronic Packaging
Spherical Alumina Powder for Electronic Packaging
Spherical Alumina Powder for Electronic Packaging


An excellent manufacturing enterprise

The company has 20 patents, the company has passed ISO9001 and ISO14001 certification, and has been recognized as a national high-tech enterprise

Spherical Alumina Powder for Electronic Packaging

 




 

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